Hyungsoo Kim : rechercher sur Z-Library

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1

[IEEE 2012 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2012.02.19-2012.02.23)] 2012 IEEE International Solid-State Circuits Conference - A 1.2V 23nm 6F2 4Gb DDR3 SDRAM with local-bitline sense amplifier, hybrid LIO sense amplifier and dummy-less array architecture

Lim, Kyu-Nam, Jang, Woong-Ju, Won, Hyung-Sik, Lee, Kang-Yeol, Kim, Hyungsoo, Kim, Dong-Whee, Cho, Mi-Hyun, Kim, Seung-Lo, Kang, Jong-Ho, Park, Keun-Woo, Jeong, Byung-Tae

Année:

2012

Langue:

english

Fichier:

PDF, 626 KB

english, 2012

2

Health Shocks, Out-of-Pocket Medical Expenses and Consumer Debt Among Middle-Aged and Older Americans

HYUNGSOO KIM, WONAH YOON, KAREN A. ZURLO

Journal:

Journal of Consumer Affairs

Année:

2012

Langue:

english

Fichier:

PDF, 584 KB

english, 2012

3

[IEEE 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Chicago, Il, USA (8-12 Aug. 2005)] 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Broadband suppression of SSN and radiated emissions using high-DK thin film EBG power distribution network for high-speed digital PCB applications

Junho Lee,, Hyungsoo Kim,, Joungho Kim,

Année:

2005

Langue:

english

Fichier:

PDF, 848 KB

english, 2005

4

Biocide application for controlling biofouling of SWRO membranes — an overview

Dooil Kim, Seunghoon Jung, Jinsik Sohn, Hyungsoo Kim, Seockheon Lee

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 212 KB

english, 2009

5

Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates

Sung-Dong Cho, Jang, K.-W., Jin-Gul Hyun, Sangyong Lee, Kyung-Wook Paik, Hyungsoo Kim, Joung-Ho Kim

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2005

Langue:

english

Fichier:

PDF, 1.57 MB

english, 2005

6

Embedded microstrip interconnection lines for gigahertz digital circuits

Woonghwan Ryu,, Seung-Ho Baik,, Hyungsoo Kim,, Jonghoon Kim,, Myunghee Sung,, Joungho Kim

Journal:

IEEE Transactions on Advanced Packaging

Année:

2000

Langue:

english

Fichier:

PDF, 297 KB

english, 2000

7

Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection

Namhoon Kim,, Myunghee Sung,, Hyungsoo Kim,, Seungyong Baek,, Woonghwan Ryu,, Jeong-Gyun An,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Année:

2001

Langue:

english

Fichier:

PDF, 176 KB

english, 2001

8

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Controlled power/ground noise on multi-layer digital printed circuit board using adaptive CMOS output driving scheme

Hyungsoo Kim,, Woonghwan Ryu,, Jonghoon Kim,, Joungho Kim,

Année:

2001

Langue:

english

Fichier:

PDF, 854 KB

english, 2001

9

RF interconnect for multi-gbit/s board-level clock distribution

Woonghwan Ryu,, Junwoo Lee,, Hyungsoo Kim,, Seungyoung Ahn,, Namhoon Kim,, Baekkyu Choi,, Donggun Kam,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Année:

2000

Langue:

english

Fichier:

PDF, 651 KB

english, 2000

10

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor

Hyungsoo Kim,, Youchul Jeong,, Jongbae Park,, SeokKyu-Lee,, JongKuk-Hong,, Youngsoo Hong,, Joungho Kim,

Année:

2003

Langue:

english

Fichier:

PDF, 325 KB

english, 2003

11

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

Junwoo Lee,, Rotaru, M.D., Iyer, M.K., Hyungsoo Kim,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Année:

2005

Langue:

english

Fichier:

PDF, 768 KB

english, 2005

12

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Youchul Jeong,, Hyungsoo Kim,, Jingook Kim,, Jongbae Park,, Joungho Kim,

Année:

2003

Langue:

english

Fichier:

PDF, 256 KB

english, 2003

13

Microwave frequency crosstalk model of redistribution line patterns on wafer level package

Myunghee Sung,, Namhoon Kim,, Junwoo Lee,, Hyungsoo Kim,, Baek Kyu Choi,, Jae-Myun Kim,, Joon-Ki Hong,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Année:

2002

Langue:

english

Fichier:

PDF, 625 KB

english, 2002

14

[IEEE 17th International Zurich Symposium on Electromagnetic Compatibility - Singapore (2006.02.27-2006.03.3)] 2006 17th International Zurich Symposium on Electromagnetic Compatibility - Characterization of SSN coupling to signal via in multi-layer PCBs and packages

Jongbae Park,, Hyungsoo Kim,, Jun So Pak,, Joungho Kim,

Année:

2006

Langue:

english

Fichier:

PDF, 255 KB

english, 2006

15

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - PCB power/ground plane edge radiation excited by high-frequency clock

Jun So Pak,, Hyungsoo Kim,, Joungho Kim,, Heejae Lee,

Année:

2004

Langue:

english

Fichier:

PDF, 434 KB

english, 2004

16

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module

Jongbae Park,, Hyungsoo Kim,, Jun So Pak,, Youchul Jeong,, Seungyong Baek,, Joungho Kim,, Jung-Joon Lee,, Jae-Joon Lee,

Année:

2004

Langue:

english

Fichier:

PDF, 377 KB

english, 2004

17

Implementing virtual platform for global-scale cyber physical system networks

Ahn, SungWon, Yoo, Chuck, Lee, ShinHyung, Lee, HyungSoo, Kim, Sung Jo

Journal:

International Journal of Communication Systems

Année:

2015

Langue:

english

Fichier:

PDF, 3.30 MB

english, 2015

18

Fabrication and utility of a transparent graphene neural electrode array for electrophysiology, in vivo imaging, and optogenetics

Park, Dong-Wook, Brodnick, Sarah K, Ness, Jared P, Atry, Farid, Krugner-Higby, Lisa, Sandberg, Amelia, Mikael, Solomon, Richner, Thomas J, Novello, Joseph, Kim, Hyungsoo, Baek, Dong-Hyun, Bong, Jihye,

Journal:

Nature Protocols

Année:

2016

Langue:

english

Fichier:

PDF, 6.85 MB

english, 2016

19

Hotel guests’ social media acceptance in luxury hotels

tom Dieck, M. Claudia, Jung, Timothy Hyungsoo, Kim, Woo Gon, Moon, Yunji

Journal:

International Journal of Contemporary Hospitality Management

Année:

2017

Langue:

english

Fichier:

PDF, 246 KB

english, 2017

20

Microstructural evolution of liquid metal embrittlement in resistance-spot-welded galvanized TWinning-Induced Plasticity (TWIP) steel sheets

Lee, Hyungsoo, Jo, Min Chul, Sohn, Seok Su, Kim, Sang-Heon, Song, Taejin, Kim, Sung-Kyu, Kim, Hyoung Seop, Kim, Nack J., Lee, Sunghak

Journal:

Materials Characterization

Année:

2019

Langue:

english

Fichier:

PDF, 3.92 MB

english, 2019

21

Effects of CH2F2 and H2 flow rates on process window for infinite etch selectivity of silicon nitride to ArF PR in dual-frequency CH2F2/H2/Ar capacitively coupled plasmas

C.K. Park, H.T. Kim, C.H. Lee, N.E. Lee, Hyungsoo Mok

Journal:

Microelectronic Engineering

Année:

2008

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2008

22

On a component mode synthesis on multi-level and its application to dynamics analysis of vehicle system supported with spring-stiffness damper system

Seongsoo Lee, Hyungsoo Mok, Chang-Wan Kim

Journal:

Journal of Mechanical Science and Technology

Année:

2011

Langue:

english

Fichier:

PDF, 640 KB

english, 2011

23

No Pain, No Strain: Impact of Health on the Financial Security of Older Americans

HYUNGSOO KIM, ANGELA C. LYONS

Journal:

Journal of Consumer Affairs

Année:

2008

Langue:

english

Fichier:

PDF, 143 KB

english, 2008

24

Unequal effects of elders’ health problems on wealth depletion across race and ethnicity

Hyungsoo Kim, Jinkook Lee

Journal:

Journal of Consumer Affairs

Année:

2005

Langue:

english

Fichier:

PDF, 123 KB

english, 2005

25

[IEEE 2012 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2012.02.19-2012.02.23)] 2012 IEEE International Solid-State Circuits Conference - A 1.2V 38nm 2.4Gb/s/pin 2Gb DDR4 SDRAM with bank group and ×4 half-page architecture

Koo, Kibong, Ok, Sunghwa, Kang, Yonggu, Kim, Seungbong, Song, Choungki, Lee, Hyeyoung, Kim, Hyungsoo, Kim, Yongmi, Lee, Jeonghun, Oak, Seunghan, Lee, Yosep, Lee, Jungyu, Lee, Joongho, Lee, Hyungyu, Ja

Année:

2012

Langue:

english

Fichier:

PDF, 304 KB

english, 2012

26

[IEEE 2009 IEEE International Conference on Cloud Computing - Bangalore, India (2009.09.21-2009.09.25)] 2009 IEEE International Conference on Cloud Computing - A RESTful Approach to the Management of Cloud Infrastructure

Han, Hyuck, Kim, Shingyu, Jung, Hyungsoo, Yeom, Heon Y., Yoon, Changho, Park, Jongwon, Lee, Yongwoo

Année:

2009

Langue:

english

Fichier:

PDF, 632 KB

english, 2009

27

Controlled release of Pantoea agglomerans E325 for biocontrol of fire blight disease of apple

In-Yong Kim, Paul Lawrence Pusey, Youfu Zhao, Schuyler S. Korban, Hyungsoo Choi, Kyekyoon Kevin Kim

Journal:

Journal of Controlled Release

Année:

2012

Langue:

english

Fichier:

PDF, 1.33 MB

english, 2012

28

[IEEE 2013 IEEE International Conference on Consumer Electronics (ICCE) - Las Vegas, NV (2013.1.11-2013.1.14)] 2013 IEEE International Conference on Consumer Electronics (ICCE) - Integration of face recognition and sound localization for a smart door phone system

Taewan Kim,, Hyungsoo Park,, Yunmo Chung,

Année:

2013

Langue:

english

Fichier:

PDF, 984 KB

english, 2013

29

Integrated system of face recognition and sound localization for a smart door phone

Kim, Taewan, Park, Hyungsoo, Hong, Sang, Chung, Yunmo

Journal:

IEEE Transactions on Consumer Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 2.23 MB

english, 2013

30

Orientation compensation for initially misaligned caster wheels

Lee, Doo-Am, Jung, Dong-Geun, Woo, Kwang-Sik, Kim, Lark-Kyo, Mok, Hyungsoo, Han, Soohee

Journal:

International Journal of Control, Automation and Systems

Année:

2013

Langue:

english

Fichier:

PDF, 433 KB

english, 2013

31

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board

Jonghoon Kim,, Baekkyu Choi,, Hyungsoo Kim,, Woonghwan Ryu,, Young-hwan Yun,, Seog-heon Ham,, Soo-Hyung Kim,, Yong-hee Lee,, Joungho Kim,

Année:

2001

Langue:

english

Fichier:

PDF, 572 KB

english, 2001

32

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Analysis of via distribution effect on multi-layered power/ground transfer impedance of high-performance packages

Hyungsoo Kim,, Jingook Kim,, Youchul Jeong,, Jongbae Park,, Joungho Kim,

Année:

2002

Langue:

english

Fichier:

PDF, 338 KB

english, 2002

33

[IEEE 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008 - Detroit, MI (2008.08.18-2008.08.22)] 2008 IEEE International Symposium on Electromagnetic Compatibility - A 6.4Gbps on-chip eye opening monitor circuit for signal integrity analysis of high speed channel

Minchul Shin,, Jongjoo Shim,, Jaemin Kim,, Jun So Pak,, Chulsoon Hwang,, Changwook Yoon,, Joungho Kim,, Hyungsoo Kim,, Kunwoo Park,, Yongju Kim,

Année:

2008

Langue:

english

Fichier:

PDF, 707 KB

english, 2008

34

A Study on Dielectric Constants of ${\rm Epoxy/SrTiO}_{3}$ Composite for Embedded Capacitor Films (ECFs)

Lee, Sangyong, Hyun, Jin-Gul, Kim, Hyungsoo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Advanced Packaging

Année:

2007

Langue:

english

Fichier:

PDF, 2.07 MB

english, 2007

35

[IEEE 1999 International Symposium on Electromagnetic Compatibility (EMC'99) - Seattle, WA, USA (2-6 Aug. 1999)] 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261) - Suppression of radiated emission from an 8-bit micro-controller using gate-oxide filtering capacitors

Hyungsoo Kim,, Jooghoon Kim,, Woonghwan Ryu,, Myunghee Sung,, Seungyoung Ahn,, Joungho Kim,

Année:

1999

Langue:

english

Fichier:

PDF, 477 KB

english, 1999

36

[IEEE 2012 Second International Conference on Digital Information Processing and Communications (ICDIPC) - Klaipeda City, Lithuania (2012.07.10-2012.07.12)] 2012 Second International Conference on Digital Information Processing and Communications (ICDIPC) - Effect of guard ring on sensitivity of the photo-transistor used in an optical mouse

Park, Sangsik, Uh, Hyungsoo, Kim, Kyuri

Année:

2012

Langue:

english

Fichier:

PDF, 534 KB

english, 2012

37

[IEEE ECCE Asia (ICPE 2011- ECCE Asia) - Jeju, Korea (South) (2011.05.30-2011.06.3)] 8th International Conference on Power Electronics - ECCE Asia - 300V DC feed system for Internet data center

Kim, Du-Hwan, Yu, Taesik, Kim, Hyosung, Mok, Hyungsoo, Park, Kyung-Seok

Année:

2011

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2011

38

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model

Jun So Pak,, Junwoo Lee,, Hyungsoo Kim,, Joungho Kim,

Année:

2003

Langue:

english

Fichier:

PDF, 244 KB

english, 2003

39

Comprehensive model for fine Coulomb fission of liquid droplets charged to Rayleigh limit

Gu, Wenhua, Heil, Philip Edward, Choi, Hyungsoo, Kim, Kyekyoon

Journal:

Applied Physics Letters

Année:

2007

Langue:

english

Fichier:

PDF, 400 KB

english, 2007

40

[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Modeling and simulation of IC and package power/ground network

Hyunjeong Park,, Dong Gun Gam,, Joungho Kim,, Hyungsoo Kim,

Année:

2006

Langue:

english

Fichier:

PDF, 433 KB

english, 2006

41

Effects of additive C[sub 4]F[sub 8] during inductively coupled BCl[sub 3]∕C[sub 4]F[sub 8]∕Ar plasma etching of TaN and HfO[sub 2] for gate stack patterning

Ko, J. H., Kim, D. Y., Park, M. S., Lee, N.-E., Lee, S. S., Ahn, Jinho, Mok, Hyungsoo

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Année:

2007

Langue:

english

Fichier:

PDF, 392 KB

english, 2007

42

[IEEE 6th IEEE Workshop on Signal Propagation on Interconnects - Pisa (2002.5.12-2002.5.12)] Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects - The Improvement of Signal Integrity (SI) according to The Location of Via in The Vicinity of A Slot in The Reference Plane

Lee, Tae, Kim, Junho, Kim, Hyungsoo, Jun, Pil, Kim, Joungho

Année:

2006

Langue:

english

Fichier:

PDF, 236 KB

english, 2006

43

An analysis of the effects of osmotic backwashing on the seawater reverse osmosis process

Park, JunYoung, Jeong, WooWon, Nam, JongWoo, Kim, JaeHun, Kim, JiHoon, Chon, Kangmin, Lee, Euijong, Kim, HyungSoo, Jang, Am

Journal:

Environmental Technology

Année:

2014

Langue:

english

Fichier:

PDF, 431 KB

english, 2014

44

Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model

Pak, Jun So, Kim, Hyungsoo, Lee, Junwoo, Kim, Joungho

Journal:

IEEE Transactions on Advanced Packaging

Année:

2007

Langue:

english

Fichier:

PDF, 2.12 MB

english, 2007

45

Older Women's Health and Its Impact on Wealth

Journal:

Journal of Women & Aging

Année:

2006

Langue:

english

Fichier:

PDF, 139 KB

english, 2006

46

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - High dielectric constant thin film embedded capacitor for suppression of simultaneous switching noise and radiated emission

Hyungsoo Kim,, Hyunjeong Park,, Youchul Jeong,, Joungho Kim,, SeokKyu-Lee,, JongKuk-Hong,, Youngsoo Hong,

Année:

2004

Langue:

english

Fichier:

PDF, 300 KB

english, 2004

47

[IEEE 2015 Symposium on VLSI Circuits - Kyoto, Japan (2015.6.17-2015.6.19)] 2015 Symposium on VLSI Circuits (VLSI Circuits) - A 4.35Gb/s/pin LPDDR4 I/O interface with multi-VOH level, equalization scheme, and duty-training circuit for mobile applications

Jung, Hae-Kang, Yang, Jaemo, Lee, Jeonghun, Ko, Hyeongjun, Lee, Hyuk, Song, Taeksang, Shim, Jongjoo, Lee, Sang-Kwon, Song, Keunsoo, Kim, Dong-Kyun, Kim, Hyungsoo, Kim, Yunsaing

Année:

2015

Langue:

english

Fichier:

PDF, 928 KB

english, 2015

48

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Analytical jitter estimation of two-stage output buffers with supply voltage fluctuations

Park, Eunkyeong, Kim, Jingook, Kim, Hyungsoo, Shon, Kwansu

Année:

2014

Langue:

english

Fichier:

PDF, 1.30 MB

english, 2014

49

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

Lee, Hyunsuk, Kim, Heegon, Kim, Kiyeong, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Lim, Jaemin, Kim, Joungho, Kim, Hyungsoo, Park, Kunwoo

Année:

2014

Langue:

english

Fichier:

PDF, 1.00 MB

english, 2014

50

Flexible bottom-gate graphene transistors on Parylene C substrate and the effect of current annealing

Park, Dong-Wook, Kim, Hyungsoo, Bong, Jihye, Mikael, Solomon, Kim, Tong June, Williams, Justin C., Ma, Zhenqiang

Journal:

Applied Physics Letters

Année:

2016

Langue:

english

Fichier:

PDF, 2.01 MB

english, 2016